Negative temperature coefficient (NTC) thermal chip material is made of high purity oxides of excessive metals Mn, Co, Ni and other elements through ball milling, solid phase reaction, powdering, isostatic molding and high temperature sintering at 1200°C~1400°C. This is our absolute advantage.

Compared with the casting method,the isostatic pressing is less efficient and has more processes,more costly,but it will make the structure of the material more uniform,which ultimately improves the densification and mechanical properties of the chip,more suitable for applications requiring high performance materials.

Whether it is a gold electrode or a silver electrode chip, it can be diced into different sizes according to the requirements of different types of products, different parameters and different applications.The performance of the chip determines the final competitiveness and ultimate strength of an enterprise.

Whether glass or epoxy encapsulated thermistors, in addition to high precision and fast thermal response, consistency, stability, repeatability are also common pursuit, these three characteristics are precisely determined by the chip performance, which is our outstanding advantage. It is also a key factor in whether mass-production can be stable and reliable.

With a chip with excellent performance, it is also necessary to have carefully selected materials, accumulated high level design and development technology, rigorous assembly processing and built-in quality control throughout the manufacturing processes in order to provide highly reliable temperature sensors.