Glass Encapsulated Thermistor
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Radial Glass Encapsulated NTC Thermistor
This radial style glass encapsulated thermistor has replaced many epoxy coated thermistors due to its high temperature resistance and good moisture resistance, and its head size can be smaller for applications in many tight and high temperature and high humidity space environments.
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Radial Glass sealed Thermistor MF57 Series With Head Size 2.3mm,1.8mm,1.6mm,1.3mm,1.1mm, 0.8mm
MF57 Series of NTC Thermistors are radial glass-encapsulated thermistors with a water and oilproof design, featuring high temperature resistance and accuracy, often used in high temperature and high humidity confined spaces. Suitable for a variety of applications including automotive, motorcycle, household appliances, industrial controls, etc.
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Long Glass Probe NTC Thermistors MF57C Series
MF57C, a glass encapsulated thermistor, can be customized with glass tube lengths, currently available in glass tube lengths of 12mm and 25mm. MF57C is resistant to high temperatures and high humidity and can be used in specific application environments.
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Diode type glass encapsulated thermistors
A range of NTC thermistors in DO-35 style glass package (diode outline) with axial solder-coated copper-clad steel wires. It’s designed for accurate temperature measurement, control and compensation. Operation up to 482°F (250°C) with excellent stability. Glass body ensures hermetic seal and voltage insulation.
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Axial Glass Encapsulated NTC Thermistor MF58 series
MF58 series, this glass encapsulated DO35 diode style thermistor is very popular in the market for its high temperature resistance, suitability for automated installation, stability, reliability and economy. Taping pack (AMMO Pack) support automatic mounting
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MELF Style Glass NTC Thermistor MF59 series
MF59 This MELF Style glass encapsulated thermistor, which is also high temperature resistant, is suitable for surface mounting on IGBT modules, communication modules, PCBs, and meets the use of automated feeding equipment for use in specific application environments.